Multi-layer polymer composite packaging material with nano-layer texture and processing method thereof

Patent name Multi-layer polymer composite packaging material with nano-layer texture and its processing method Patent applicant Sichuan University Principal Applicant Address 610065 Chen Limin, Inventor of College of Polymer Science and Engineering, Sichuan University, Mozi Bridge, Chengdu, Sichuan; (Patent) No. 200510020945.0 Date of application 2005.05.25 Certification date Approval Notice No. 1693149 Auditing announcement date 2005.11.09 Manual CD-ROM D0545 Main classification number B65D65/40 Classification number B65D65/40; B65D1/12; B32B27/00; B29D22/00 ;B29C69/00;//B29L22:00 division Original application number Priority Item Abstract This invention discloses a multi-layer polymer composite packaging material having a nano-layer texture and a processing method thereof, wherein the composite packaging material can be formed by Two kinds of polymers with parallel heterostructures and cross-knit structures are obtained by micro-layer co-extrusion, cooling molding, heat treatment, and hot stretching. The c-axis and epitaxial phase of the basal phase polymer layer are obtained. The c-axis of the polymer layer intersects, and the cumulative thickness of the base-phase polymer layer is 50-99% of the thickness of the packaging material. A layer thickness of 1 to 50% of the thickness of the packaging material, and a layer thickness of epiphytic phase polymer layer is 50-300 nm. In the invention, the nano-layer reinforced phase of the braided structure is formed in the packaging material, and the two-phase crystal regions are bridged with each other, so the defects in the amorphous region are greatly reduced, and the composite packaging material has high strength and ductility. Such excellent mechanical properties, but also has a very high barrier and corrosion resistance. Sovereignty Item 1. A multi-layer polymer composite packaging material having a nano-layer texture characterized in that the composite packaging material comprises a base-phase polymer layer and an epitaxial phase that can form a non-parallel chain heterophase epitaxial cross-knit structure. The crystal layers of the polymer layer are staggered and overlapped, wherein the c-axis of the crystal of the epitaxial phase polymer layer intersects with the c-axis of the base-phase polymer platelet, and the cumulative thickness of each layer of the base-phase polymer layer is the total amount of the packaging material. The thickness of 50-99% of the thickness, cumulative thickness of each layer of the epitaxial phase polymer layer is 1-50% of the total thickness of the packaging material, and the thickness of the single layer of the epitaxial phase polymer layer is 50-300 nm. International Application International Announcement Date of Entry into the Country Patent Agency Chengdu Kehai Patent Affairs Co., Ltd. Agency Address Agent Lu Jianping