Easy to open thin package

Patent name Easy-to-open thin-layer package Patent applicants Pegasus Sewing Machine Manufacturing Co., Ltd. Principal Applicant Address Osaka Prefecture, Japan Inventor Morimoto Kasei Application (Patent) No. 200510068710.9 Date of Application 2005.04.29 Certification Date Approval Publication No. 1693150 Auditing Announcement Day 2005.11.09 Instruction CD-ROM D0545 Main classification number B65D77/30 Classification number B65D77/30 Division Original application number Priority item 2004.4.30 JP 2004-135814 Abstract A thin-layer package (P) has a first package ( 1) and the second package (2). By partially overlapping, the first package body (1) is set on the second package body (2), and the overlapping portion (L) is fixed in the double-strand stitch sewing machine and sewn. The sewing portion (D) of the chain stitch is formed into the portion (L). By pulling the sewing end (4a) of the loop thread (4) of the sewing part (D) forming the chain stitch, the sewing part (D) of the chain stitch is disassembled from the sewing end part, and the two packages are made (1, 2) Separated from each other. Sovereignty Item 1. A thin-layer package for packaging solid pieces, characterized in that the first package and the second package are partially overlapped, the overlapped part is sewn by chain stitch stitching, and the stitching is The sewing end of the department cuts the needle thread and the thread. International Application International Publication Date of Entry into the Country Patent Agencies China Council for the Promotion of International Trade Patent and Trademark Office Agency Address Agent Jiang Xurong